4008云顶游戏官网 HUABO(SUZHOU)THINFILM TECHNOLOGY CO.,LTD
金属膜层 | 功能 | 制作方法 | 典型厚度范围 |
TaN/NiCr | 电阻层 | Sputter | 5Ω/□~200Ω/□;温度系数:-20±60ppm(-50~150℃) |
TiW | 黏附层/阻挡层 | Sputter | 20nm~80nm |
Ti | 黏附层 | Sputter | 20nm~80nm |
Cr | 黏附层 | Sputter | 20nm~80nm |
Pt | 阻挡层 | Sputter | 20nm~100nm |
Ni | 阻挡层 | Sputter or plate | Sputter:0.1μm~1μm plate: 0.5μm~10μm |
Cu | 导体 | Sputter or plate | Sputter:0.1μm~5μm plate: 1μm~10μm |
Au | 导体 | Sputter or plate | Sputter:0.05μm~0.2μm plate: 0.3μm~10μm |